ST0011 Copper (Cu) Sputtering Target

Copper (Cu) Sputtering Target Description

The Copper (Cu) Sputtering Target is engineered for high-precision thin film deposition used in a variety of high-tech applications. Manufactured with a purity of ≥99%, this target ensures consistent and reliable performance in semiconductor fabrication, display technologies, and photovoltaic devices. Its excellent electrical conductivity and inherent corrosion resistance make it an ideal material for achieving high-quality coatings under DC sputtering conditions. The product is available in disc form or custom-made configurations to suit specialized industrial requirements.

Copper (Cu) Sputtering Target Applications

· Thin Film Deposition: Ideal for semiconductor manufacturing, integrated circuits, and display panels.
· Vacuum Coating: Provides uniform, high-quality coatings for optical, electronic, and solar applications.
· Surface Engineering: Enhances wear resistance and stability in various mechanical and electronic components.
· Advanced Research: Used in laboratories for developing new materials and nano-fabrication technologies.

Copper (Cu) Sputtering Target Packing

Our Copper (Cu) Sputtering Targets are securely packaged to maintain their purity and performance during transit.
- Standard vacuum-sealed packaging options available in 5kg per bag or customized packaging solutions upon request.

Frequently Asked Questions

Q: What are the main applications for the Copper (Cu) Sputtering Target?
A: It is primarily used for thin film deposition in semiconductor manufacturing, vacuum coating in display and solar industries, and advanced surface engineering applications.

Q: What is the significance of achieving a purity level of ≥99%?
A: A high purity level ensures minimal contamination during sputtering, leading to superior film quality and reliable performance in high-tech manufacturing processes.

Q: Can the shapes of the Copper (Cu) Sputtering Target be customized?
A: Yes, apart from standard discs, our targets can be custom-made to meet specific design and application requirements.

Q: What does DC sputtering mean, and why is it important?
A: DC sputtering uses a direct current power supply to generate a plasma that dislodges material from the target, ensuring uniform film deposition. This technique is essential for high-quality thin film applications.

Q: How is the Copper (Cu) Sputtering Target packaged to ensure its quality?
A: The target is vacuum-sealed in specialized packaging to protect it from contamination and physical damage during storage and transportation.