ST0028 Magnesium (Mg) Sputtering Target

Magnesium (Mg) Sputtering Target Description

Magnesium (Mg) Sputtering Target is precisely engineered for advanced sputtering applications. Manufactured with rigorously controlled purity and uniformity, this target ensures consistent performance in depositing high-quality thin films. Its optimized design contributes to superior stability and efficiency across various industrial processes. Whether for research or large-scale production, this target meets the stringent requirements of modern electronic and optical applications.

Magnesium (Mg) Sputtering Target Specifications

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Magnesium (Mg) Sputtering Target Applications

· Thin Film Deposition: Essential for fabricating microelectronic circuits and semiconductor devices.
· Optical Coatings: Provides consistent performance in applications requiring durable and uniform thin films.
· Surface Engineering: Used in various surface modification processes to enhance adhesion and durability.
· Research & Development: A reliable choice for experimental prototyping and advanced technology development. 

Magnesium (Mg) Sputtering Target Packing

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Packaging: Carton, Wooden Box, or Customized.

Manufacturing Process

Manufacturing Process

Elemental Analysis Methods

·        Metal Element Analysis: Conducted using ICP-OES (Inductively Coupled Plasma Optical Emission Spectrometry).

·        Gas Element Analysis: Conducted using LECO analysis

Frequently Asked Questions

Q: What is a sputtering target?
A: A sputtering target is a material source used in physical vapor deposition processes to release atoms through ion bombardment, which then deposit onto a substrate to form thin films.

Q: How does DC sputtering function with this target?
A: In DC sputtering, a direct current is applied to the target, creating a plasma that ionizes the sputter gas. These ions then strike the target, causing material to be ejected and deposited on the substrate.

Q: Which industries benefit most from using a Magnesium sputtering target?
A: Industries such as electronics, optics, semiconductor manufacturing, and surface engineering benefit greatly from the reliable performance of Magnesium sputtering targets.

Q: How is the high purity of the target ensured during manufacturing?
A: High purity is maintained through rigorous quality control processes, advanced material preparation techniques, and strict adherence to relevant industry standards.

Q: Can the target be customized to specific dimensions?
A: Yes, the Magnesium sputtering target is available in customized sizes and shapes to meet the specific requirements of various sputtering applications.